Diamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting Wheel

Product Details
Customization: Available
Material: Diamond
Abrasive: Superabrasive

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  • Diamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting Wheel
  • Diamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting Wheel
  • Diamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting Wheel
  • Diamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting Wheel
  • Diamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting Wheel
  • Diamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting Wheel
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Basic Info.

Model NO.
RGW01
Shapes
Edge Shape
Types
Surface Grinding Wheel
Grain Size
280#
Cylindricity
<0.05
Circular Degree
<0.05
Technics
Sinter
Working Style
Surface Grinding
Transport Package
Wooden Box
Specification
Customized
Trademark
yaxin
Origin
Henan, China
HS Code
8207201000
Production Capacity
5000

Product Description

Product name Resin Grinding Wheel
Material Imported diamond & CBN abrasive
thickness Customized
width Customized
grit Customized
place of origin Henan, China
Diamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting WheelDiamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting WheelDiamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting WheelDiamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting WheelDiamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting WheelDiamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting Wheel

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