Premium Diamond Dicing Blade for Accurate Semiconductor Cutting

Product Description

OEM ODM	support
Product customized	support

Product Overview

The Advanced Diamond Dicing Blade is a high-performance cutting tool engineered for precision dicing of semiconductor materials, including silicon wafers, gallium arsenide (GaAs), silicon carbide (SiC), glass, ceramics, and other brittle substrates. Utilizing a diamond-abrasive edge bonded to a ultra-thin metallic or resin core, this blade delivers exceptional cutting accuracy, minimal kerf loss, and superior surface integrity. It is designed for use with dicing saws (e.g., Disco, Accretech) in semiconductor fabrication, LED manufacturing, and microelectronics processing.

Company Profile

Product Description

Product Description

Product Description
Product name       Dicing Blades
Advantage      High Working Efficiency
Feature      Long Life High Performance
Application      Cutting of Optical Glass
Certificate       ISO 9001
place of origin      Henan, China

Key Features

Ultra-Precision Cutting

Kerf Width: As low as 10 µm (e.g., 0.015 mm thickness blades) for minimal material loss.
Cutting Tolerance: ±0.5 µm, ensuring precise street alignment and die separation.
Surface Finish: Achieves Ra ≤ 0.1 µm on cut edges, reducing post-processing needs.
Diamond-Abrasive Technology

Electroplated or Sintered Diamond: Provides exceptional hardness and wear resistance.
Abrasive Grit Sizes: #600–#3000 (fine to ultra-fine) for roughing to finishing cuts.
High Concentration: Optimized diamond density for extended blade life.
Advanced Core Materials

Metal Core (e.g., Stainless Steel): High rigidity for stable, vibration-free cutting.
Resin Core: Enhanced flexibility for cutting delicate materials.
Nickel or Bronze Bonds: Improved heat dissipation and abrasive retention.
Thermal and Mechanical Stability

Heat Resistance: Withstands high-speed dicing (30,000–50,000 RPM) without degradation.
Low Vibration: Balanced design reduces chipping and micro-cracks.
Customization Flexibility

Blade Diameter: 2-inch (50 mm), 3-inch (76 mm), or custom sizes.
Thickness: 0.015 mm–0.5 mm (standard and ultra-thin options).
Hub Designs: Non-hub, aluminum hub, or stainless steel hub for compatibility with dicing saws.
 
Technical Specifications
 
 
Parameter
Specifications
Blade Diameter
2-inch (50 mm), 3-inch (76 mm), or custom
Thickness Range
0.015 mm–0.5 mm (e.g., 0.020 mm for ultra-precision)
Abrasive Type
Diamond (Electroplated or Sintered)
Grit Size
#600–#3000 (Fine to Ultra-Fine)
Hub Type
Non-Hub, Aluminum Hub, Stainless Steel Hub
Max RPM
40,000–60,000 RPM (Depends on diameter and core material)
Applications
Silicon wafers, SiC, GaAs, glass, ceramics, MEMS
 
Applications
Semiconductor Dicing:

Singulation of silicon ICs, memory chips, and sensors.
Power Devices:

Cutting silicon carbide (SiC) and gallium nitride (GaN) wafers.
LED and Display Manufacturing:

Dicing sapphire substrates, glass panels, and OLED layers.
MEMS and Optics:

Precision cutting of quartz, lithium niobate, and optical ceramics.
 
Operational Guidelines
Machine Compatibility:

Designed for dicing saws (e.g., Disco DFD series, Accretech A-D series).
Coolant Requirements:

Use deionized water or coolant sprays to reduce heat and remove debris.

Packaging & Shipping

Certifications

Why Choose This Diamond Dicing Blade?

High Accuracy: Ideal for micron-level dicing with minimal kerf loss.
Long Service Life: Diamond abrasives outlast conventional blades by 10–20x.
Customization: OEM/ODM support for grit, size, and hub designs.
Industry Compliance: Meets SEMI standards for semiconductor manufacturing.
 
Ordering Information
Samples: Available for testing (e.g., $50–$200/blade based on specifications).
MOQ: As low as 5 pieces for prototyping; bulk discounts for production orders.
Lead Time: 7–15 days for standard blades; custom designs require 20–30 days.
Certification: Provided with material test reports and SEMI compliance documentation.
 
Conclusion
The Advanced Diamond Dicing Blade combines cutting-edge abrasive technology with precision engineering to meet the demanding requirements of semiconductor and electronics manufacturing. Its ability to deliver clean, accurate cuts on brittle materials makes it an essential tool for high-volume production and R&D. Contact us for technical specifications, samples, and customized solutions!

Tags: Diamond Dicing Blade, Semiconductor Cutting, Wafer Dicing, Precision Abrasives, Disco Blade, Semiconductor Manufacturing.

FAQ

1. Why Choose Yaxin Superhard?

With a legacy of expertise dating back to 1997, we are a certified High-Tech Enterprise trusted by industry leaders like BYD, Gree, and Midea. Our operations are fully certified under ISO 9001, ISO 14001, and ISO 45001. We don't just sell tools; we deliver proven reliability and comprehensive solutions engineered to enhance your productivity.

2. What is your Quality & Warranty Policy?

We stand firmly behind our products with a comprehensive 2-year warranty against any manufacturing defects. Our commitment to quality is absolute, ensured by a rigorous management system that guarantees every tool we produce delivers consistent, high-performance results on your production line.

3. Do you offer free samples?

Yes, we do. For new partners, we believe the best way to demonstrate our value is through a small, complimentary sample package of our standard tools. For more specialized or high-value items, we recommend starting with a small trial order. We are so confident in our technology that we are happy to credit the cost of this trial order towards your first official volume purchase.

4. What are your payment and shipping terms?

We offer flexible payment terms to support our partners, including T/T (Bank Transfer) and PayPal. For shipping, we provide a full range of global logistics solutions—Sea, Air, and Land freight—and can work with your preferred freight forwarder to ensure fast, safe, and reliable delivery to your facility.

5. How do you package the products to ensure safety?

Our packaging process is meticulous. Each tool is first placed in its own box, carefully protected with anti-collision materials like bubble wrap. These individual boxes are then secured within a larger outer container. Depending on the order's weight and value, we use either heavy-duty, multi-layered cartons or sturdy wooden cases, ensuring maximum protection during international transit. Delivery is typically 3-30 days, confirmed based on your specific order.