Resin Bond Diamond Blades for Semiconducter Packages Such as Qfn

Product Details
Customization: Available
Material: Diamond
Abrasive: Superabrasive

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  • Resin Bond Diamond Blades for Semiconducter Packages Such as Qfn
  • Resin Bond Diamond Blades for Semiconducter Packages Such as Qfn
  • Resin Bond Diamond Blades for Semiconducter Packages Such as Qfn
  • Resin Bond Diamond Blades for Semiconducter Packages Such as Qfn
  • Resin Bond Diamond Blades for Semiconducter Packages Such as Qfn
  • Resin Bond Diamond Blades for Semiconducter Packages Such as Qfn
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Basic Info.

Model NO.
DB01
Shapes
Edge Shape
Types
Cutting Wheel
Grain Size
280#
Cylindricity
<0.02
Circular Degree
<0.01
Technics
Sinter
Working Style
Cutting
Machining Way
Cutting
Advantage
High Working Efficiency
Type
Abrasive Disc
Application
Glass
Characteristic
Precision
Size
Customized
Transport Package
Plastic Bag & Carton Box
Specification
Customized
Trademark
yaxin
Origin
Henan, China
HS Code
8207201000
Production Capacity
50000

Product Description

Product name Diamond Dicing Blades
Advantage High Working Efficiency
Characteristic Precision
Application Glass
Certificate ISO 
place of origin Henan, China
Resin Bond Diamond Blades for Semiconducter Packages Such as QfnResin Bond Diamond Blades for Semiconducter Packages Such as QfnResin Bond Diamond Blades for Semiconducter Packages Such as QfnResin Bond Diamond Blades for Semiconducter Packages Such as QfnResin Bond Diamond Blades for Semiconducter Packages Such as QfnResin Bond Diamond Blades for Semiconducter Packages Such as Qfn

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