Back Grinding Wheel for Silicon Wafer

US$2,500.00
1-9 Pieces
US$2,000.00
10-99 Pieces
US$1,500.00
100+ Pieces
Product Details
Customization: Available
Material: Diamond
Shapes: Edge Shape
Zhengzhou Yaxin Superhard Materials Co., Ltd.
Manufacturer/Factory

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Henan, China
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Back Grinding Wheel for Silicon Wafer pictures & photos
Back Grinding Wheel for Silicon Wafer pictures & photos
Back Grinding Wheel for Silicon Wafer pictures & photos
Back Grinding Wheel for Silicon Wafer pictures & photos
Back Grinding Wheel for Silicon Wafer pictures & photos
Back Grinding Wheel for Silicon Wafer pictures & photos
  • Back Grinding Wheel for Silicon Wafer
  • Back Grinding Wheel for Silicon Wafer
  • Back Grinding Wheel for Silicon Wafer
  • Back Grinding Wheel for Silicon Wafer
  • Back Grinding Wheel for Silicon Wafer
  • Back Grinding Wheel for Silicon Wafer
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Product Description

Company Info.

Basic Info.

Model NO.
GW28
Types
Surface Grinding Wheel
Grain Size
280#
Working Style
Surface Grinding
Grinding Material
Cubic Boron Carbide
Shape
Cylindrical
Bonding Agent
Vitrified & Resin
Wheel Type
Angle Grinding Wheels
Bond
Vitrified & Resin
Wheel Base
Steel
Transport Package
Wooden Box
Specification
Customized
Trademark
yaxin
Origin
China
HS Code
8207201000
Production Capacity
5000

Product Description

Product name Diamond Grinding Wheel
Material Imported diamond abrasive
Shape Cylindrical
Feature Long Life
grit size 80#---1000#
place of origin Henan, China
Back Grinding Wheel for Silicon WaferBack Grinding Wheel for Silicon WaferBack Grinding Wheel for Silicon WaferBack Grinding Wheel for Silicon WaferBack Grinding Wheel for Silicon WaferBack Grinding Wheel for Silicon Wafer

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