Back Grinding Wheels for Silicon Wafers Thinning Process

Product Details
Customization: Available
Material: Diamond
Shapes: Edge Shape

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  • Back Grinding Wheels for Silicon Wafers Thinning Process
  • Back Grinding Wheels for Silicon Wafers Thinning Process
  • Back Grinding Wheels for Silicon Wafers Thinning Process
  • Back Grinding Wheels for Silicon Wafers Thinning Process
  • Back Grinding Wheels for Silicon Wafers Thinning Process
  • Back Grinding Wheels for Silicon Wafers Thinning Process
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Basic Info.

Model NO.
GW31
Types
Surface Grinding Wheel
Grain Size
280#
Working Style
Surface Grinding
Grinding Material
Cubic Boron Carbide
Shape
Cylindrical
Bonding Agent
Vitrified & Resin
Wheel Type
Angle Grinding Wheels
Bond
Vitrified & Resin
Wheel Base
Steel
Transport Package
Wooden Box
Specification
Customized
Trademark
yaxin
Origin
China
HS Code
8207201000
Production Capacity
5000

Product Description

Product name Diamond Grinding Wheel
Material Imported diamond abrasive
Shape Cylindrical
Feature Long Life
grit size 80#---1000#
place of origin Henan, China
Back Grinding Wheels for Silicon Wafers Thinning ProcessBack Grinding Wheels for Silicon Wafers Thinning ProcessBack Grinding Wheels for Silicon Wafers Thinning ProcessBack Grinding Wheels for Silicon Wafers Thinning ProcessBack Grinding Wheels for Silicon Wafers Thinning ProcessBack Grinding Wheels for Silicon Wafers Thinning Process

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